大功率电源散热硅胶片 进口HF300P相变硅胶片 高导热硅胶绝缘片详细介绍

Phase change thermal interface materials (TIMs) are an effective alternative to thermal greases, saving time and money without sacrificing thermal performance. The no mess-thixotropic characteristics keep phase change material from flowing out of the interface during operating temperatures, but are a solid at room temperature and easy to handle.

HI-FLOW phase change materials are an excellent replacement for grease as a thermal interface between a CPU or power device and a heat sink. The materials change from a solid at specific phase change temperatures and flow to provide a total wet-out of the interface without overflow. The result is a thermal interface comparable to grease, without the mess, contamination and hassle.

The HI-FLOW family of phase change TIMs covers a wide range of applications. Henkel’s BERGQUIST brand offers leading thermal management solutions. Our technical experts work closely with customers to select the proper HI-FLOW material for specific application requirements.

相变热界面材料是热润滑硅脂的有效替代品，可在不牺牲热性能的情况下节省时间和金钱。无杂乱触变特性可防止相变材料在工作温度下流出界面，但在室温下是固体，易于处理。

HI-FLOW相变材料是作为CPU或功率器件与散热器之间的热界面的润滑硅脂的极好替代品。材料在特定的相变温度和流动下从固体变化，以提供界面的完全浸湿而不会溢出。结果是与润滑硅脂相当的热界面，没有混乱，污染和麻烦。

HI-FLOW系列相变材料涵盖了广泛的应用。汉高的BERGQUIST品牌提供***的热管理解决方案。

HI-FLOW handles like BERGQUIST SIL PAD materials at room temperature, but flows like grease at its designed phase change temperature. The following is an overview of the important features shared by the HI-FLOW family:

• Comparable thermal performance to grease in most applications

• Thermally conductive phase change compound

• Aluminum, film or fiberglass carriers and non-reinforced versions

• Low volatility

• Easy to handle and apply in the manufacturing environment

• Tackified or tack-free at room temperature

FLOW系列共享的重要功能概述：

• 在大多数应用中，润滑硅脂具有可比的热性能

• 导热相变化合物

• 铝，薄膜或玻璃纤维载体和非增强型

• 低波动性

• 易于处理并适用于制造环境

• 在室温下增粘或不粘

Using HI-FLOW materials instead of grease can save time and money without sacrificing thermal performance. There are numerous benefits including:

• No mess – thixotropic characteristics of the materials keep it from flowing out of the interface

• Easier handling – tackified or tack-free at room temperature

• No protective liner required

• High thermal performance helps ensure CPU reliability

• Do not attract contaminants

• Easier material handling and shipping

• Simplified application process

Hi-Fliow300P相变化优点：

• 没有混乱 - 材料的相变特性使其不会流出界面

• 易于处理 - 在室温下增粘或不粘

• 无需保护衬垫

• 高热性能有助于确保CPU可靠性

• 不易吸引污染物

• 更轻松的物料搬运和运输

• 简化申请流程

The broad HI-FLOW family offers a variety of choices to meet performance, handling and process needs. Some of the choices include:

• Some HI-FLOW materials are available with or without adhesive

• Aluminum carrier for applications not requiring electrical isolation

• Film or fiberglass carrier for electrical isolation

• Dry, non-reinforced material

• Tackified or tack-free at room temperature

• Tabbed parts, die-cut parts, sheets or bulk rolls

• Adhesive specifically for cold application without preheating heat sink

• Customized options are available. Tooling charges vary depending on the complexity of the part.

Hi-Fliow300P相变化应用：

• HI-FLOW材料适用于消费和工业电子，汽车，医疗，航空航天和电信应用，例如：

• UPS和SMPS AC / DC，DC / DC或线性电源

• 在CPU和散热器之间

• 电源转换装置

• 分数和积分电机控制

• 带引线，表面贴装和电源模块组件